Achievements examples
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The ruggedized and enhanced version of the AU Bonder for mass production, dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of indusrial plotters print heads.
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Chamber allowing the compression under vacuum of elements up to 800°C and 100Mpa during 1min30.
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Silicon wafer assembling and bonding machine. -
OptoBonder machine range for flip chip bonding.
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Cleanroom and ESD design
Brushless motors with Galil axis control card, closed control loops for position and force -
Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads.
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Bench for the determination of the spectral response of infrared sensors for the future European weather satellite.
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Bench for measuring the geometry of the infrared sensors of the future European meteorological satellite.
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Metal lace cutting machine for spiral spring making
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Dynamic torque measurement on watch components
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Measurement of the elongation of a watch strap subjected to a force to validate the assembly and strength of fasteners.
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Automatic machine for control for assembly of the mesh used to make the watch bands.
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Module focusing all the flux emitted by an array of UV LEDs on a single line.
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Vision system using the principle of confocal chromatic measurement to determine the elevation of the pixels of an image.
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Resistance test machine for composite wind turbine blades.
