The ruggedized and enhanced version of the AU Bonder for mass production, dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of indusrial plotters print heads.
Chamber allowing the compression under vacuum of elements up to 800°C and 100Mpa during 1min30.
Silicon wafer assembling and bonding machine. |
OptoBonder machine range for flip chip bonding.
Cleanroom and ESD design
Brushless motors with Galil axis control card, closed control loops for position and force
Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads.
Bench for the determination of the spectral response of infrared sensors for the future European weather satellite.
Bench for measuring the geometry of the infrared sensors of the future European meteorological satellite.
Metal lace cutting machine for spiral spring making
Dynamic torque measurement on watch components
Measurement of the elongation of a watch strap subjected to a force to validate the assembly and strength of fasteners.
Automatic machine for control for assembly of the mesh used to make the watch bands.
Module focusing all the flux emitted by an array of UV LEDs on a single line.
Vision system using the principle of confocal chromatic measurement to determine the elevation of the pixels of an image.
Resistance test machine for composite wind turbine blades.