Assembly machine sensors for the aerospace industry

Automated assembly of sensors used in demanding aerospace environements. The machine performs the bonding of wafers on metal supports, the assembly constitutes the sensor.

• Integrated vision with automatic calibration.
• Integrated tool magazine.
• Trajectories defined in space in ISO programming.
• Bead width: 0,8 mm.
• Absolute precision of dispensing: < 0,1 mm.
• Vision control of the dispensing of the glue bead.
• Ergonomic wafer loading.
• Positioning accuracy: < 10 µm.
• Programming and control touch screen.

The assembly machine uses SYZAX motorized linear axes, a new system of compact, high-performance and precise modular axes.